Lead Free
Lead Free + Peekable SM
Red Soldermask
Lead Free + Gold Finger
ENIG + Black Soldermask
OSP + Blue Soldermask
| Items | Capability |
|---|---|
| 1.Panel size | 24” x 18” |
| 2. Max layer Counts | 10 |
| 3. Board Thickness(max)(min) | 0.2-3.2 mm |
| 4. Via Hole Size(min) | 0.20 mm |
| 5. Aspect Ratio | 8 : 1 |
| 6. Line Width Spacing 1/2 oz(outer)(inner) | 3.5/3.5 mil |
| 7. Layer to Layer Registration | 5 mil |
| 8. Soldermask Plug Hole | 0.7 mm (max) |
| 9. Max Copper thickness(Inner) | 3/3 OZ |
| 10. Max Copper thickness(Outer) | 5/5 OZ |
| 11. Surface Finish | LF-HASL OSP ENIG Gold Finger Flash Gold (Thick) Electro-gold Plating Im – Silver Im – Tin |
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